? semiconductor components industries, llc, 2005 august, 2005 ? rev. 2 1 publication order number: mbrs410et3/d mbrs410et3 preferred device surface mount schottky power rectifier this device employs the schottky barrier principle in a large area metal?to?silicon power diode. state?of?the?art geometry features epitaxial construction with oxide passivation and metal overlay contact. ideally suited for low voltage, high frequency rectification, or as free wheeling and polarity protection diodes, in surface mount applications where compact size and weight are critical to the system. typical applications are ac?dc and dc?dc converters, reverse battery protection, and ?oring? of multiple supply voltages and any other application where performance and size are critical. features ? very low v f accompanied by low i r ? 1st in the market place with a 10 v r schottky rectifier ? small compact surface mountable package with j?bend leads ? rectangular package for automated handling ? highly stable oxide passivated junction ? designed for low leakage ? excellent ability to withstand reverse avalanche energy transients ? guard?ring for stress protection ? pb?free package is available mechanical characteristics ? case: epoxy, molded ? weight: 217 mg (approximately) ? finish: all external surfaces corrosion resistant and terminal leads are readily solderable ? lead and mounting surface temperature for soldering purposes: 260 c max. for 10 seconds ? polarity: notch in plastic body indicates cathode lead ? esd ratings: machine model = c human body model = 3b maximum ratings rating symbol value unit peak repetitive reverse voltage working peak reverse voltage dc blocking voltage v rrm v rwm v r 10 v average rectified forward current (@ t l = 130 c) i o 4.0 a non?repetitive peak surge current (surge applied at rated load conditions halfwave, single phase, 60 hz) i fsm 250 a operating junction temperature t j ?65 to +150 c maximum ratings are those values beyond which device damage can occur. maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. if these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. device package shipping ? ordering information mbrs410et3 smc 2500/tape & reel schottky barrier rectifiers 4.0 amperes, 10 volts preferred devices are recommended choices for future use and best overall value. http://onsemi.com smc case 403 plastic b4e1 = specific device code a = assembly location y = year ww = work week = pb?free package (note: microdot may be in either location ) marking diagram ayww b4e1 MBRS410ET3G smc (pb?free) 2500/tape & reel ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specification brochure, brd8011/d.
mbrs410et3 http://onsemi.com 2 thermal characteristics characteristic symbol 5 mm x 5 mm (note 2) 1 inch x 1/2 inch unit thermal resistance, junction?to?lead thermal resistance, junction?to?ambient r jl r ja 12 109 7.0 59 c/w electrical characteristics maximum instantaneous forward voltage (note 1) v f t j = 25 c t j = 100 c v (i f = 2.0 a) (i f = 4.0 a) (i f = 8.0 a) 0.475 0.500 0.525 0.370 0.395 0.430 maximum instantaneous reverse current (note 1) i r t j = 25 c t j = 100 c a (rated dc voltage, v r = 5.0 v) (rated dc voltage, v r = 10 v) 50 150 2000 4000 1. pulse test: pulse width 300 s, duty cycle 2%. 2. mounted with minimum recommended pad size, pc board fr4. figure 1. typical forward voltage 0.1 0.3 0.4 0.6 0.2 0.5 10 0.1 1 i f , instantaneous forward current (a) v f , instantaneous forward voltage (v) figure 2. maximum forward voltage 0.1 0.3 0.4 0.6 0.2 0.5 100 0.1 1 v f , maximum instantaneous forward voltage (v) i f , maximum instantaneous forward current (a) figure 3. typical reverse current 2610 04 8 1.0e?02 i r , reverse current (a) v r , reverse voltage (v) figure 4. typical capacitance v f @ 125 c 100 c 75 c ?40 c 25 c v f @ 125 c 100 c 25 c 1.0e?03 i r @ 125 c 100 c 75 c 25 c 261 0 04 8 1000 c, capacitance (pf) v r , reverse voltage (v) 10,000 25 c f = 1 mhz 0.7 100 0.7 10 75 c 1.0e?04 1.0e?05 1.0e?06 1.0e?07
mbrs410et3 http://onsemi.com 3 figure 5. current derating, junction?to?lead 100 110 130 120 0 5 i f , average forward current (a) t l , lead temperature ( c) figure 6. forward power dissipation 1346 02 5 3.5 0 1.5 i f(av) , average forward current (a) p fo , average power dissipation (w) figure 7. thermal response, junction?to?ambient (min pad) 1 2 3 4 9 6 7 8 square wave dc rated voltage applied r jl = 12 c/w t j = 125 c 79 8 0.5 1 2.5 2 3 t j = 125 c square wave dc t, time (s) 0.0001 0.001 0.1 0.00001 0.01 1 10 100 100 0 r (t) , transient thermal resistance ( c/w) 0.1 1 10 100 d = 0.5 0.2 0.1 single pulse 0.05 0.02 0.01 140 160 150 figure 8. thermal response, junction?to?ambient (1 inch pad) t, time (s) 0.0001 0.001 0.1 0.00001 0.01 1 10 100 100 0 r (t) , transient thermal resistance ( c/w) 0.1 1 10 100 d = 0.5 0.2 0.1 single pulse 0.05 0.02 0.01
mbrs410et3 http://onsemi.com 4 package dimensions smc plastic package case 403?03 issue e dim a min nom max min millimeters 1.90 2.13 2.41 0.075 inches a1 0.05 0.10 0.15 0.002 b 2.92 3.00 3.07 0.115 c 0.15 0.23 0.30 0.006 d 5.59 5.84 6.10 0.220 e 6.60 6.86 7.11 0.260 l 0.76 1.02 1.27 0.030 0.084 0.095 0.004 0.006 0.118 0.121 0.009 0.012 0.230 0.240 0.270 0.280 0.040 0.050 nom max 7.75 7.94 8.13 0.305 0.313 0.320 h e 4.343 0.171 3.810 0.150 2.794 0.110 mm inches scale 4:1 *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* e bd c l1 l a1 a notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. d dimension shall be measured within dimension p. 4. 403?01 thru ?02 obsolete, new standard 403?03. h e 0.020 ref 0.51 ref l1 on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its of ficers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. publication ordering information n. american technical support : 800?282?9855 toll free usa/canada japan : on semiconductor, japan customer focus center 2?9?1 kamimeguro, meguro?ku, tokyo, japan 153?0051 phone : 81?3?5773?3850 mbrs410et3/d literature fulfillment : literature distribution center for on semiconductor p.o. box 61312, phoenix, arizona 85082?1312 usa phone : 480?829?7710 or 800?344?3860 toll free usa/canada fax : 480?829?7709 or 800?344?3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : http://onsemi.com order literature : http://www.onsemi.com/litorder for additional information, please contact your local sales representative.
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